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• Pitch 0.8 mm
• SMT process compatible
• Hermaphroditic contact design, two contact points
• One part number for interconnection saving admin and logistic costs
• Integrated pick and place pad and very low weight for high speed assembly
• Positioning pegs
• Secure standing while solder process, large solder pads
• Black insulation body and silver terminals for optical vision system (contrast measuring methode)
• Polarization and pre-alignment while mating
• Mated stacking height: 3 mm (wipe length: 0 mm) or 5 mm (wipe length: 1.5 mm)
• SMT process compatible
• Hermaphroditic contact design, two contact points
• One part number for interconnection saving admin and logistic costs
• Integrated pick and place pad and very low weight for high speed assembly
• Positioning pegs
• Secure standing while solder process, large solder pads
• Black insulation body and silver terminals for optical vision system (contrast measuring methode)
• Polarization and pre-alignment while mating
• Mated stacking height: 3 mm (wipe length: 0 mm) or 5 mm (wipe length: 1.5 mm)
